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| T2 copper / 2A50 diffusion welding process, welding Aluminum Alloy and Microstructure Analysis
Content distribution can be seen that Al content generally decreased until the last side of the copper matrix to zero, but the content of aluminum in the weld zone fluctuations: Figure below shows that the copper content along the curve the distribution of scan lines, copper content generally decreased, but the 2A50 is A1. Cu alloy. Therefore, some still in the aluminum content of Cu. Similarly, the copper content in the weld zone fluctuations are more apparent. This occurs in the weld zone may produce a new phase. The content of aluminum and copper content of certain proportional relationship. Figure 5 shows the surface scan results. Figure 5 (b) known, the mass fraction of Cu 56.91%. Atomic fraction of 35.93%; aluminum content is 43.09%. Atomic fraction is 64.07%. By the Cu-Al binary phase diagram shows. The temperature 515 ~ 525 ℃, accounting for 43.09% aluminum content may be processing technology, \. copper side of the transition zone; c. aluminum side of the transition zone) joint of Figure 4, the distribution of copper and aluminum elements (a) energy spectrum measurement position (b) EDS analysis of Figure 5 joint surface scan results to the diffusion region to compounds CuA1 0 as the base of the solid solution phase and the solid solution based CuA1 112 equivalent [71. 2.3X-ray diffraction X-ray diffraction analysis of the weld joints and 2A50 T2/2A5O matrix to determine the phase composition, the results shown in Figure 6 instructions. Figure 6 (a) shows that: 2A50 main phase is the matrix Al, There is also a small amount of CuA12 and Mg, A1 peak was higher than CuA12 peak. By measuring the known: CuA12 content accounted for 7.6%, A1 accounted for 88.3%. (A) rl'CuA12l10Mgl ★ ★ ★ ● 0j ∞!, 2O30405060708090203040506070809020 / (.) 2, (.) 6X-ray diffraction patterns of Figure (a.2A50 matrix; b-Weld) Figure 6 (b) shows that: Al peak slightly less than CuA1 peak. Obtained by measuring the total Al content of 43.6%, CuA12 content of 56.4%. Results show. Weld and there 2A50 base intermetallic compound CuA12. However, the content of the weld CuA12 2A50 matrix CuA1 than high, and this is due to the weld, all spread over the copper atoms and aluminum atoms are formed CuA1. Under the experimental conditions in the intermetallic compounds CuA1 generated more, and thus the weld is wider. A1, Cu atoms in the interface interdiffusion. Penetrate the grain boundary to be connected to the surface of aluminum and copper atoms at the distance decreases. Van der Waals attraction force generated between the two metal penetration into the interface of a mechanical occlusion,air jordan shoes cheap, metallurgical bonding, and interfacial reaction products CuA1 achieve atomic bond connectivity [4]. 3 Conclusions (1) using the method of diffusion bonding, welding can be achieved under non-vacuum conditions with the 2A50 aluminum alloy T2 copper connection. Connect the pressure required for small welds produced intermetallic CuA1, achieve metallurgical bonding. But CuA1 presence will affect the joint performance. Should be through the heating temperature, holding time and pressure control of process parameters to reduce the CuA1:, and to improve joint performance. (2) T2/2A50 connector from the T2 base in the middle seam, 2A50 matrix of three parts. In T2 between the substrate and the formation of a dense weld new phase compound layer. References: l】 【TRANSACTIONS OF THE CHINA, Wang Juan, Liu Peng. Difficult to weld dissimilar materials, welding and application 【M】. Beijing: Chemical Industry Press. 2003. 【2】 TRANSACTIONS OF THE CHINA,ed hardy clothing, Wang Juan, Liu Qiang. 【M】 non-ferrous metal welding applications. Beijing: Chemical Industry Press. 2006. 【3】 Qi Yongxin, Yang Ruipeng. Advances in welding aluminum and copper [J]. Welding Technology, 2000,ed hardy,29 (5) :4-5. 【4】 Xie Jun, Wu Weidong, Ye Chenggang, et al. AI / Cu thin film vacuum diffusion bonding technology】 【J, Laser and Particle Beams. 2004,16 (5) :607-610. 【5】 Zoujia Sheng,ugg prezzo, materials, principles and processes connected 【M】. Harbin: Harbin Institute of Technology Press. 2005. 【6】 Peng TRANSACTIONS OF THE CHINA, Juan, et al. Mg / AI vacuum diffusion bonding interface of dissimilar materials, the microstructure region】 【J. Welding Journal, 2004,25 (5) :5-8. 【7】 Zhao Yumin, had Yue Jian, Zhang Bingfan. Cu-Al intermetallic compounds during diffusion bonding behavior [J】. Tianjin University,stivali ugg, 1984, (Suppl): 18.28. Field Processing Volume 36, 2007, l9 of 相关的主题文章： stivali ugg Principle-based incentive interruptibl air jordans Pingguo Aluminum utilization of red mu ugg milano Boeing 747SP aircraft main landing gear |
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